Triamec Motion AG
TSP700-10, TSP700-30 new generation 700V servo drives with 9.3kW and 24kW power.
|2018||TSD350: 350V dual-axis Servo-Drive with 10A per axis|
|2016||TSD130: 130V dual-axis Servo-Drive 10A per axis; EtherCAT compatibility for TSD drives.|
|2015||TSD80: First 80V dual-axis servo drive with 10A per axis|
|2012||TSP350: First 20A servo drive|
|2011||Technology leadership: Continuous auto-calibration of 1Vss sin/cos encoders|
|2010||TSP700: First 100kHz 3-level PWM servo drive with 9.5kW power at max. 800V|
|2009||Renamed Triamec Motion AG|
|2008||Moved to a larger location in Zug with laboratories and warehouse|
|2007||TS350: First 400V servo drive with 10A|
|2005||Presentation of the first in-house product TS100 on the occasion of the SPS-Drives trade fair in Nuremberg:
A high-end servo drive with 100kHz control and real-time capability in 10kHz cycles
|2004||Start in-house development of a servo drive for high-end applications|
|2003||Moved to larger offices in Cham|
|2002||Engineering services in the field of progressive lenses, air bearings, wire-bonder control technology|
|2001||Foundation of Triamec AG with headquarters in Zug|
Dr. Urs Probst (CEO and Chairman of the Board)
Co-founder of Triamec, Urs graduated in mechanical engineering with a major in robotics at the ETH Zurich in 1994, whereupon he worked as an R&D engineer in the field of semiconductor assembly machines (die bonding). In 1999, he continued his studies at EPFL and graduated in 2002 with a PhD on "High Speed, High Accuracy Pick-and-Place".
Dr. Ladislav Kucera (CTO and Member of the Board)
Co-founder of Triamec, Ladislav studied electrical engineering at the ETH Zurich, specializing in control engineering and power electronics. Afterwards he worked as an assistant at the Institute of Robotics at the ETH Zurich and did research in the field of magnetic bearings. In 1997, he received his PhD with the paper on sensorless magnetical bearings "Zur sensorlosen Magnetlagerung". Afterwards he worked first as a development engineer and finally as a department head in a company for semiconductor assembly automation (die and wire bonders).